Base Material: FR4 TG140
PCB Thickness: 1.6+/-10% mm
Layer Count: 2L
Copper Thickness: 1.5/1.5 oz
Surface treatment: HASL-LF
Solder mask: White
Silkscreen: Black
Special process : No x-out accepted
Short Description:
Base Material: FR4
PCB Thickness: 1.6+/-10%mm
Layer Count: 6L
Copper Thickness: 3/3OZ
Surface treatment: ENIG 2U”
Solder mask: Black
Silkscreen: White
Special process : Unmanned aerial vehicle PCB, HDI
Layer Count: 10L
Copper Thickness: 1OZ
Solder mask: Blue
Special process : Communication board
Base Material: FR4 TG170
Solder mask: Green
Special process : HDI
Layer Count: 4L
Surface treatment: ENIG
Special process : Thick copper
Copper Thickness: 1Z
Special process : Impedance PCB
PCB Thickness: 0.8+/-0.11mm
Special process : Consumer Electronics
PCB Thickness: 1.0+/-10%mm
Copper Thickness: 2/2OZ
Special process : automobile lamp PCB
Copper Thickness: 2/2 OZ
Special process : electric automobile lamp PCB
Special process : electric car PCB
Special process : electric vehicle PCB