Gene Sequencing HDI PCB DNA Sequencing Board Medical Circuit Board PCB for Medical Equipment
Gene Sequencing HDI PCB DNA Sequencing Board Medical Circuit Board PCB for Medical Equipment
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Base Material: |
FR4 TG135 |
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PCB Thickness: |
1.6+/-0.16 mm |
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Layer Count: |
10L, HID |
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Copper Thickness: |
1/1/1/1/1/1/1/1/1/1 oz |
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Min. Line width/spacing: |
3.5/4.0 mil |
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Min. Hole: |
0.15mm |
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Surface treatment: |
ENEPIG 2u" + Hard Gold Plating (Edge Connector/Fingers) 4u" |
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Solder mask: |
Black |
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Silkscreen: |
White |
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Application area : |
Medical Device PCB |
The Key Carrier for Decoding Life — Unveiling the High-End Medical Device PCB in Gene Sequencers
With the rapid development of precision medicine, gene sequencing technology is gradually entering clinical practice and the public eye. As the "neural network" of a sequencer, the technical sophistication of its PCB often determines the stability and accuracy of the entire system.
Today, we will conduct an in-depth analysis of a high-end medical device circuit board used in gene sequencing equipment.
Core Specifications at a Glance
Base Material: Military/Medical Grade FR4
Layers: 10-layer precision stack-up
Key Technology: HDI
Special Surface Finishes: ENEPIG 2u" + Hard Gold Plating (Edge Connector/Fingers) 4u"
Process Limit: PTH hole to inner layer line spacing of only 5mil
High-Density Interconnect (HDI): During operation, a gene sequencer needs to process massive amounts of biological fluorescence signal conversion and data transmission. This places extremely high demands on the PCB.
Within the 10-layer structure, HDI technology utilizes micro vias and buried vias to significantly reduce signal reflection during interlayer connections. This not only saves space but, more importantly, ensures the integrity of high-frequency signals during transmission, guaranteeing zero errors in sequencing data.
Surface Finish Technology:
This board employs a combination of hard gold electroplating (4U") for the edge connector and electroless nickel palladium gold (2U") for other areas.
4U" Hard Gold Electroplating (Edge Connector): Used for interfaces subjected to frequent plugging and unplugging. The extreme hardness ensures it does not deform or wear out even after tens of thousands of insertions.
2U" Electroless Nickel Palladium Gold (ENEPIG): Applied to the core soldering areas. The gold layer is extremely thin and uniform, ensuring excellent solderability. Its unique palladium layer effectively prevents diffusion between gold and copper, inhibiting the formation of brittle IMC, thereby greatly enhancing long-term reliability.
Extreme Process Precision:
The PTH hole to inner layer line spacing is only 5mil. On FR4 material, this represents an extremely challenging process. During the lamination of a 10-layer board, any minor expansion or shrinkage can lead to hole deviation. Being able to stably control this within 5mil signifies that the manufacturing process possesses exceptional expansion/shrinkage control and drilling alignment accuracy, ensuring foolproof electrical connections between each layer.
Low cost, high integration, and portability—gene sequencing PCBs are bringing precision medicine into thousands of households, making the decoding of life's code no longer out of reach. Every advancement in medical device PCBs paves the way for humanity to explore the mysteries of life. This is more than just a board; It is the bridge connecting the microscopic world to the digital realm.